the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. bipolar analog integrated circuit pc1458 general purpose dual operational amplifier document no. g12195ej6v0ds00 (6th edition) (previous no. ic-1973a) date published march 2004 n cp(k) printed in ja p an data sheet the mark shows major revised points. c description the pc1458 is a dual general purpose operational amplifier having internal frequency compensating circuits. it is intended for a wide range of analog applications. high common mode voltage range and no latch up tendencies make this amplifier ideal for use as a voltage follower. features ? internally frequency-compensated short circuit protection equivalent circuit (1/2 circuit) connection diagram (top view) 1 1 2 3 4 8 7 6 5 v + out 2 i i2 i n2 + ? 2 out 1 i i1 i n1 v ? + ? pc1458c, 1458g2 i n i i + q 1 q 2 q 8 q 9 q 12 r 5 q 13 q 3 q 5 q 6 r 1 r 2 r 4 r 3 q 11 c 1 30 pf q 16 q 18 q 15 q 19 q 14 q 20 q 23 q 22 r 11 r 12 r 9 r 10 q 17 r 7 q 21 q 25 q 24 d 1 q 7 q 10 q 4 ? 50 k ? 39 k ? 1 k ? 50 k ? 50 ? 1 k ? 5 k ? 50 k ? 30 ? 25 ? out v ? v + ordering information part number package quality grade pc1458c 8-pin plastic dip (7.62 mm (300)) standard pc1458g2 8-pin plastic sop (5.72 mm (225)) standard please refer to "quality grades on nec semiconductor devices" (document no: c11531e) published by nec electronics corporation to know the specification of the quality grade on the device and its recommended applications.
data sheet g12195ej6v0ds 6 pc1458 package drawings (unit: mm) 14 85 item millimeters notes 1. each lead centerline is located within 0.25 mm of its true position (t.p.) at maximum material condition. p8c-100-300b,c-2 n 0.25 p 0.9 min. r0 15 a 10.16 max. b 1.27 max. f 1.4 min. g 3.2 0.3 j 5.08 max. k 7.62 (t.p.) c 2.54 (t.p.) d 0.50 0.10 h 0.51 min. i 4.31 max. l 6.4 m 0.25 + 0.10 ? 0.05 2. ltem "k" to center of leads when formed parallel. m a r m p i j h g f dn c b 8-pin plastic dip (7.62mm(300)) l k
data sheet g12195ej6v0ds 7 pc1458 item b c i 8-pin plastic sop (5.72 mm (225)) d e f g h j p millimeters 1.27 (t.p.) 0.78 max. 4.4 0.15 0.1 0.1 0.42 1.59 0.21 6.5 0.3 1.49 + 0.08 ? 0.07 1.1 0.2 3 + 7 ? 3 note each lead centerline is located within 0.12 mm of its true position (t.p.) at maximum material condition. a 5.2 + 0.17 ? 0.20 k l m n 0.6 0.2 0.17 0.12 0.10 + 0.08 ? 0.07 s8gm-50-225b-6 85 1 4 s m c detail of lead end a m s n f g b e d p h i j k l
data sheet g12195ej6v0ds 8 pc1458 recommended soldering conditions the pc1458 should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact an nec electronics sales representative. for technical information, see the following website. semiconductor device mount manual (http ://www.necel.com/pkg/en/mount/index.html) types of surface mount device pc1458g2: 8-pin plastic sop (5.72 mm (225)) process conditions symbol infrared ray reflow peak temperature: 230 c or below (package surface temperature), reflow time: 30 seconds or less (at 210c or higher), maximum number of reflow processes: 1 time. ir30-00-1 vapor phase soldering peak temperature: 215c or below (package surface temperature), reflow time: 40 seconds or less (at 200c or higher), maximum number of reflow processes: 1 time. vp15-00-1 wave soldering solder temperature: 260c or below, flow time: 10 seconds or less, maximum number of flow processes: 1 time, pre-heating temperature: 120c or bel ow (package surface temperature). ws60-00-1 partial heating method pin temperature: 300c or below, heat time: 3 seconds or less (per each side of the device). ? caution apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. types of through hole device pc1458c: 8-pin plastic dip (7.62 mm (300)) soldering method soldering conditions recommended condition symbol wave soldering solder temperature: 260c or below, flow time: 10 seconds or below
pc1458 the information in this document is current as of march, 2004. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets or data books, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality, reliability and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) (1) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. (2) "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). ? ? ? ? ? ? m8e 02. 11-1
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